High-density 400G/800G OSFP, QSFP-DD transceivers and ruggedized industrial Ethernet switches engineered for hyperscale AI clusters and telecom networks.
Telco-grade reliability designed for hyperscale data centers and harsh industrial environments.
High-bandwidth optical modules engineered for next-generation AI GPU superclusters.
IP40 aluminum housing with redundant power inputs (-40°C to +85°C extended temp).
Direct Attach Copper and Active Optical Cables for short-range rack interconnects.